Relevant case studies

Blog post: 05/11/2025 9:36 am

Author: Spark Team

VR SOP Training for Semiconductor Packaging & Test (OSAT)

Clear, step-by-step training for wire-bond, die attach and handlers

Packaging and test need precise processes and fast changeovers. Spark builds bespoke VR training that mirrors your die-attach, wire-bond, mould, singulation, test handlers and final pack—so teams learn the exact sequence before touching live devices.

Common problems we fix

• Die attach: epoxy amount, placement accuracy and cure control.
• Wire bond: loop height, pull/shear limits and ball quality.
• Mould & singulation: bleed/flash, delamination and saw alignment.
• Handlers & sockets: ESD control, contact wear and binning errors.

How our custom build works

1. Capture your SOPs: recipes, limits, GR&R checks and acceptance criteria.
2. Create scenarios: tool set-up, bond qualification, mould cure, handler changeover.
3. Coach in VR: simple prompts that match your WI and MES screens.
4. Measure: right-first-time, yield impact and re-training needs.

Benefits

• Higher yield with fewer bond and mould defects.
• Faster changeovers across packages and products.
• Audit-ready competence records for customers.

Why Spark

Your tools, recipes and QA gates—no generic content. Practice equals performance.

Plan a bespoke OSAT VR trainer. Contact Spark.

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